Hong Kong Exchanges and Clearing Limited and The Stock Exchange of Hong Kong Limited take no responsibility for the contents of this announcement, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this announcement.
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION中 芯 國 際集 成 電 路 製 造 有 限 公 司 *
(incorporated in the Cayman Islands with limited liability) (Stock Code: 981)
DELAY IN DESPATCH OF CIRCULARReferences are made to:
the announcement of the Company dated 21 March 2016 ("Announcement A") regarding the continuing connected transactions in relation to the Centralised Fund Management Agreement; and
the announcement of the Company dated 30 March 2016 ("Announcement B") regarding the major transaction and continuing connected transactions in relation to the Framework Agreement -.
Capitalised terms used in this announcement shall have the same meanings as defined in Announcement A and Announcement B unless otherwise defined herein.
As disclosed in Announcement A and Announcement B, the Company initially expected to despatch a circular containing the following content to the Shareholders on or before 3 May 2016:
in relation to Announcement A, among other things, (i) further details on the Centralised Fund Management Agreement; (ii) a letter from the Independent Board Committee to the Independent Shareholders; (iii) a letter from the Independent Financial Adviser containing its advice to the Independent Board Committee and the Independent Shareholders together with (iv) a notice convening the EGM; and
in relation to Announcement B, among other things, (i) further details on the Framework Agreement; (ii) a letter from the Independent Board Committee to the Independent Shareholders; (iii) a letter from the Independent Financial Adviser containing its advice to the Independent Board Committee and the Independent Shareholders (including its opinion on the term of the Framework Agreement) together with (iv) a notice convening the EGM.
As additional time is required to finalise the information to be contained in the circular, the despatch of the circular will be delayed and the Company expects to despatch the circular on or before 7 June 2016.
Semiconductor Manufacturing International CorporationDr. Tzu-Yin Chiu
Chief Executive Officer and Executive Director
Shanghai, 3 May 2016
As at the date of this announcement, the directors of the Company are:
Executive Directors
Zhou Zixue (Chairman)
Tzu-Yin Chiu (Chief Executive Officer) Gao Yonggang (Chief Financial Officer)
Non-executive Directors
Chen Shanzhi (Li Yonghua as his Alternate) Zhou Jie
Ren Kai Lu Jun
Independent Non-executive Directors
William Tudor Brown Sean Maloney
Lip-Bu Tan
Carmen I-Hua Chang
* For identification purposes only
SMIC - Semiconductor Manufacturing International Corporation published this content on 03 May 2016 and is solely responsible for the information contained herein.
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