Semiconductor Packaging Market anticipated to reach US$ 27.028 billion by 2029 at a CAGR of 2.48%

The semiconductor packaging market is estimated to grow at a CAGR of 2.48% to reach US$27.028 billion in 2029 from US$22.769 billion in 2022.

NOIDA, UTTAR PRADESH, INDIA, February 14, 2024 /EINPresswire.com/ -- According to a new study published by Knowledge Sourcing Intelligence, the semiconductor packaging market is projected to grow at a CAGR of 2.48% between 2022 and 2029 to reach US$27.028 billion by 2029.

Increasing consumer fascination with sophisticated electronic devices, technological advancements in packaging solutions, heightened focus on miniaturization and integration, a surge in demand for high-performance and energy-efficient solutions, and the growing adoption of 5G technology are driving the expansion of the semiconductor packaging market.

Semiconductor packaging materials play a crucial role in safeguarding semiconductor devices from degradation and external influences during the final stages of production. Materials such as organic substrates, solder balls, bonding wires, and lead frames are employed to ensure superior performance and protect electronic equipment from corrosion and wear. The rising popularity of electronic devices like tablets, mobile phones, and communication devices has led to an increased demand for the semiconductor packaging market. The significant expansion of the semiconductor and IC packaging market is attributed to factors such as the growing demand for consumer electronics. Furthermore, key competitors in the semiconductor and IC packaging materials market are poised for substantial growth, given the increasing awareness regarding the use of electronic packaging materials. Intel had developed a novel semiconductor packaging called Foveros Omni, which was released in September 2023. Utilizing the 3D packaging method, Foveros Omni enabled the stacking of multiple dies on top of each other, leading to significant gains in performance and power efficiency.

Access sample report or view details: https://www.knowledge-sourcing.com/report/semiconductor-packaging-market

The semiconductor packaging market encompasses various packaging types, including Advanced Packaging, Flip Chip, Embedded Die, Fan-Out Level Packaging (FO-WLP), and Fan-In Level Packaging (FI-WLP). Advanced Packaging represents a sophisticated approach in semiconductor packaging, incorporating innovative techniques for enhanced performance. Flip Chip packaging involves the direct attachment of semiconductor chips to the substrate, optimizing space and electrical performance. Embedded Die packaging integrates semiconductor dies directly into the substrate, streamlining the overall design and promoting compactness. Fan-Out Level Packaging (FO-WLP) and Fan-In Level Packaging (FI-WLP) are methodologies that involve arranging and connecting semiconductor elements on different levels, contributing to efficient and flexible packaging solutions. The diverse packaging types cater to the evolving needs of the semiconductor industry, offering a range of options to address various performance and design requirements.

The ceramic package segment is expected to lead the market in terms of revenue and is anticipated to experience substantial growth. Ceramic packaging primarily consists of 90% to 94% aluminum oxide (Al2O3), complemented by glass-forming alkaline earth silicates as the remaining components. These packages typically encase a silicon chip and are sealed with a top made of glass or metal. The sub-segment associated with ceramic packaging is poised for continuous development throughout the forecast period. This growth is attributed to the significant surge in demand for ceramic packaging, particularly from the automotive sector. The rapid integration of electronic components into various vehicle parts, encompassing safety features, comfort, stability, and high performance, is driving the increased adoption of ceramic packaging in this industry.

The semiconductor packaging market is categorized by end-users, with prominent sectors including Consumer Electronics, Aerospace and Defense, Medical Devices, and Communication and Telecom. In the realm of Consumer Electronics, semiconductor packaging plays a crucial role, in meeting the demands of an ever-evolving array of electronic devices such as smartphones, laptops, and smart appliances. The Aerospace and Defense sector relies on semiconductor packaging for applications that demand high reliability, durability, and performance in extreme conditions. In the Medical Devices field, semiconductor packaging contributes to the development of cutting-edge healthcare technologies, ensuring precision and reliability in diagnostic and therapeutic equipment. The Communication and Telecom industry heavily depends on semiconductor packaging to support the robust infrastructure required for efficient data transmission and communication networks. Each end-user segment reflects the diverse applications and specialized requirements that drive the continuous growth and innovation within the semiconductor packaging market.

Asia Pacific has emerged as the frontrunner in the semiconductor packaging market, leading in terms of revenue share and is expected to maintain this position in the foreseeable future. The region, particularly countries like China, Taiwan, South Korea, and Singapore, has become a global hub for semiconductor production. Substantial investments in infrastructure, advanced technology, and a skilled workforce have created an advantageous environment for the semiconductor supply chain. Asia Pacific boasts key players such as TSMC (Taiwan Semiconductor Manufacturing Company), Samsung, and SK Hynix, which are among the largest and most advanced semiconductor companies globally. These companies are driving innovation in semiconductor packaging technologies and setting industry standards. The region has developed specialized clusters for semiconductor production, exemplified by Taiwan's Hsinchu Science Park, housing a prominent semiconductor research and development centre. The economies of scale achieved through high-volume semiconductor manufacturing in the Asia Pacific contribute to cost reductions for local companies. Moreover, significant investments in research and development across Asia Pacific nations underscore the commitment to fostering innovation and keeping the semiconductor field at the forefront of packaging techniques and materials.

Intel Corporation, Samsung Electronics Co. Ltd, and Amkor Technology are among the leading companies in the semiconductor packaging industry. Other significant players include Unisem (M) Berhad, Powertech Technology Inc., ChipMOS TECHNOLOGIES INC., and Fujitsu Semiconductor Limited. ASE, ISI - Interconnect Systems, Jiangsu Changjiang Electronics Technology Co. Ltd (JCET), and Powertech Technology Inc. also contribute to the dynamic landscape of semiconductor packaging. These companies, each with its unique strengths and capabilities, play crucial roles in driving innovation, setting industry standards, and meeting the diverse demands of the rapidly evolving semiconductor market.

The market analytics report segments the semiconductor packaging market on the following basis:

• BY PACKAGING TYPE

o Advanced Packaging
o Flip Chip
o Embedded Die
o Fan-Out Level Packaging (FO-WLP)
o Fan-In Level Packaging (FI-WLP)

• BY PACKAGING MATERIAL

o Organic Substrate
o Leadframe
o Ceramic Packaging
o Bonding-Wire
o Others

• BY END-USER

o Consumer Electronics
o Aerospace and Defense
o Medical Devices
o Communication and Telecom
o Others

• BY GEOGRAPHY

o North America

• United States
• Canada
• Mexico

o South America

• Brazil
• Argentina
• Others

o Europe

• United Kingdom
• Germany
• France
• Italy
• Spain
• Others

o Middle East and Africa

• Saudi Arabia
• UAE
• Others

o Asia Pacific

• Japan
• China
• India
• South Korea
• Taiwan
• Thailand
• Indonesia
• Others

Companies Profiled:

• ASE
• Amkor Technology
• Powertech Technology Inc.
• Fujitsu Semiconductor Limited
• ChipMOS TECHNOLOGIES INC.
• Intel Corporation
• Samsung Electronics Co. Ltd
• Unisem (M) Berhad
• ISI - Interconnect Systems
• Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)

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Ankit Mishra
Knowledge Sourcing Intelligence
+1 850-250-1698
info@knowledge-sourcing.com
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