S3 Semiconductors selected to advance Satellite Transceiver Technology in ESA ARTES Partner Programme
Dublin –12th October 2017 – S3 Semiconductors, a global supplier of Mixed-Signal and RF Application Specific Integrated Circuit (ASIC) solutions, today announced that it has been commissioned to advance new architectures for Satellite Transceiver technology under the auspices of a current ARTES Partner programme. S3 Semiconductors is very well positioned for future opportunities related to it. The programme is jointly funded by the European Space Agency (ESA) and a leading mobile satellite communications services operator
“At S3 Semiconductors we are delighted to be involved in the research and development of new technology which will underpin the delivery of innovative mobile satellite communication services in the future. For the mass rollout of these new services, it is imperative that these mobile satellite-connected devices have small form factors, are low on power and are economically viable for the market. This architecture development will enhance further our significant expertise in providing economic high-performance ASIC solutions. It aligns with our strategy to be the ASIC vendor of choice in the mobile satellite services market segment” said Dermot Barry, Vice President and General Manager at S3 Semiconductors.
The ESA funding for the program is provided by the member countries who are supporting this programme, including Ireland.
Minister of State for Training, Skills, Innovation, Research and Development, John Halligan T.D. welcomed the announcement: “This is a significant achievement by an Irish operation and the government is keen to support this R&D initiative under the ESA ARTES framework. The development of this IP is central to S3 Semiconductors’ strategy in the mobile satellite communications market and will support future growth of the company and the addition of new high-value R&D product engineering jobs in its locations in Dublin and Cork in the coming years.“
Gearóid Mooney, Divisional Manager, Research & Innovation, Enterprise Ireland stated that “S3 Semiconductors is yet another example of the growing number of Irish companies benefitting from Ireland’s membership of ESA. In line with the national strategy for ESA, this highly significant development contract will support further growth within the company in key export markets”.
About S3 Semiconductors
S3 Semiconductors designs advanced mixed-signal chips and manage every aspect of supplying production devices to its customers using some of the world’s most advanced semiconductor production facilities. With more than 20 years’ experience designing advanced analog and digital circuitry for hundreds of customers in every major region, S3 Semiconductors delivers a new breed of design-centric semiconductor supplier capable of optimising its designs for every customer, yet achieving cost economies not thought possible with custom chips designs until now. S3 Semiconductors has its headquarters in Dublin, Ireland, with offices in Cork, the US, Portugal, the Czech Republic, along with representatives worldwide. Visit www.s3semi.com
|
Related News
- The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications
- S3 Semiconductors joins Arm Approved design partner program
- S3 Semiconductors Expands Sales Rep Network
- S3 Group ICs Drive New Iridium 9602 Satellite Data Transceiver
- Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |