Semiconductor Advanced Substrate Market is projected to experience a CAGR of 11.52% throughout the forecast period

The semiconductor advanced substrate market is anticipated to grow at a CAGR of 11.52% during the forecast period.

NOIDA, UTTAR PARDESH, INDIA, December 6, 2023 /EINPresswire.com/ -- According to a new study published by Knowledge Sourcing Intelligence, the semiconductor advanced substrate market is projected to grow at a CAGR of 11.52% between 2021 and 2028.

The key driving force behind the rapid growth of the global semiconductor advanced substrate market is the increasing demand for consumer electronics and technology advancements.

Semiconductor advanced substrates are essential components in the field of semiconductor packaging materials and plays a significant part in the packaging of integrated circuits (ICs) and electronic components. These substrates serve as the foundation for the complicated variety of integrated circuits and semiconductors. As the demand for consumer electronics and mobile communication devices expands, tech companies deliver more compact, portable, and high-performance products. This trend contributes to the demand for advanced substrates in IC packaging. Due to increasing demand, many governments have invested in semiconductors to bolster their electronics sector. For instance, in September 2022, to support Aatma Nirbhar Bharat's vision, the Government of India granted a comprehensive program for the development of India's semiconductor and display manufacturing ecosystem, with a budget of 76,000 crore. The objective of the program is to provide companies involved in semiconductor packaging and semiconductor design with attractive incentive support.

The market is witnessing numerous product launches and advancements. For instance, in November 2023, AT&S, one of the global leading manufacturers of IC substrates and PCBs, announced its plans to supply IC substrates to AMD semiconductor companies. AT&S substrates are an essential component of AMD data center processors that power the electronic experiences of future generations, from AI to VR. Likewise, in December 2022, DuPont introduced CYCLOTENET photo-imageable dry-film dielectric material to improve advanced semiconductor packaging for 5G, AI, and advanced applications. It has high thermal stability and good dielectric properties, allowing it to provide signal integrity over a wide frequency range.

Access sample report or view details: https://www.knowledge-sourcing.com/report/semiconductor-advanced-substrate-market

The global semiconductor advanced substrate market, based on type is segmented into five main categories namely advanced IC substrate, FC BGA, FC CSP, substrate-like-PCB (SLP), and embedded die. The advanced IC substrate segment is expected to grow and account for a major share of the global semiconductor advanced substrate market.

The global semiconductor advanced substrate market, based on application is segmented into four main categories namely consumer electronics, automotive and transportation, IT and Telecom, and others. The consumer electronics segments is expected to grow and account for a major share of the global semiconductor advanced substrate market.

Asia-Pacific is poised to experience substantial growth in the market. With major semiconductor manufacturing hubs in countries such as China, Taiwan, South Korea, and Japan, the region has become a global center for producing electronics and semiconductor-related components. These countries have developed cutting-edge manufacturing facilities and a skilled labor force to produce IC substrates. Numerous governments are investing and launching new projects in semiconductors to boost the market. For instance, Taiwan’s compound semiconductor project (2022-2025) will include firms from all stages of the semiconductor value chain, from upstream to downstream operations. Taiwan is working on the Angstrom Semiconductor Initiative (2021-2025) to investigate cutting-edge devices, circuits, processes, and testing innovations that will meet the semiconductor industry's needs in the coming decade.

The research includes coverage of ASE Group, Fujitsu Limited, Ibiden Co. Ltd., Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd, TTM Technologies Inc, Unimicron Technology Corporation are significant market players in the global semiconductor advanced substrate market.

The market analytics report segments the semiconductor advanced substrate market using the following criteria:

• By Type

o Advanced IC Substrate
o FC BGA
o FC CSP
o Substrate-like-PCB (SLP)
o Embedded Die

• By Application

o Consumer Electronics
o Automotive and Transportation
o IT and Telecom
o Others

• By Geography

o North America

• United States
• Canada
• Mexico

o South America

• Brazil
• Argentina
• Others

o Europe

• Germany
• France
• United Kingdom
• Spain
• Others

o Middle East and Africa

• Saudi Arabia
• UAE
• Israel
• Others

o Asia Pacific

• China
• Japan
• India
• South Korea
• Indonesia
• Taiwan
• Others

Companies Profiled:

• ASE Group
• Fujitsu Limited
• Ibiden Co. Ltd.
• Kinsus Interconnect Technology Corp.
• Korea Circuit Co. Ltd.
• KYOCERA Corporation
• LG Innotek Co. Ltd.
• Nan Ya PCB Co. Ltd
• TTM Technologies Inc
• Unimicron Technology Corporation

Explore More Reports:

• Semiconductor Etch Equipment Market: https://www.knowledge-sourcing.com/report/semiconductor-etch-equipment-market

• Semiconductor Front-End Equipment Market: https://www.knowledge-sourcing.com/report/semiconductor-front-end-equipment-market

• Semiconductor Manufacturing Material Market: https://www.knowledge-sourcing.com/report/semiconductor-manufacturing-material-market

Ankit Mishra
Knowledge Sourcing Intelligence LLP
+1 850-250-1698
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