UltraMemory Turns to NanoSpice, NanoSpice Giga From ProPlus Design Solutions for Design of Super-Broadband, Large-Scale Memory

Full Circuit Simulation Solutions Replaced Other Simulators for Small Block, Full-Chip Memory Designs

/EINPresswire.com/ -- SAN JOSE, CA -- (Marketwired) -- 05/24/16 -- UltraMemory Inc. (UltraMemory) has selected NanoSpice™ and NanoSpice Giga™ from ProPlus Design Solutions, Inc., the leading technology provider of giga-scale parallel SPICE simulation, SPICE modeling solutions and Design-for-Yield (DFY) applications, to simulate its super-broadband, super large-scale memory design.

UltraMemory is developing innovative 3D DRAM chip, which includes Through Chip Interface (TCI), enabling low-cost and low-power wireless communication between stacked DARM when compared to TSV technology.

Highly accurate and high-capacity SPICE simulation was necessary because it needed to simulate several DRAM chips with analog functions. UltraMemory's decision to adopt NanoSpice, a high-performance parallel SPICE simulator, and NanoSpice Giga, the industry's only GigaSpice simulator, came after an extensive evaluation of commercial SPICE and FastSPICE circuit simulators. NanoSpice and NanoSpice Giga have been integrated in UltraMemory's existing design flows to replace other SPICE and FastSPICE simulators to provide full circuit simulation solutions from small block simulation to full-chip verification.

NanoSpice was validated for its high-accuracy, fast simulation speed and analysis feature compatibilities. NanoSpice Giga proved itself to be a worthy replacement to FastSPICE with a pure SPICE engine for higher accuracy, and advanced parallelization technologies for superior performance and giga-scale simulation features. Its usability removed the UltraMemory user's need to operate complicated FastSPICE options and tuning.

By fully leveraging the computation power of advanced multi-core servers and offering a unique license model, ProPlus simulation tools offer several times higher simulation performance or throughput than other circuit simulators with the same level of investment in hardware and software licenses.

"UltraMemory aims to improve the performance of the next-generation computer system by developing the super-broadband and super-large scale memory," says Mr. Takao Adachi, President and Chief Executive Officer (CEO) of UltraMemory Inc. "As a result, we have very high standards for simulation accuracy and performance for our large scale memory designs. ProPlus' NanoSpice and NanoSpice Giga were selected as total circuit simulation solutions in our design flow. They have proven to be accurate and fast, delivering impressive simulation throughput and unique advantages with their pure SPICE simulation engines for all our advanced memory design needs."

"UltraMemory has a great vision for developing leading-edge memory for its next-generation computer system," remarks Dr. Zhihong Liu, ProPlus' chairman and CEO. "We welcome the opportunity to be part of this important project. NanoSpice and NanoSpice Giga fit this opportunity with their full range of simulation capacities from small blocks to full chip SPICE-accurate simulation power, and can help achieve goals that would be difficult to reach without our circuit simulation solutions."

ProPlus will demonstrate NanoSpice and NanoSpice Giga, along with its new ME-Pro™ process and device evaluation tool, during the Design Automation Conference (DAC) in Booth #1219 Monday, June 6, through Wednesday, June 8, from 10 a.m. until 6 p.m. DAC will be held at the Austin Convention Center, Austin, Texas.

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry's golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com

About Jedat
Jedat is the exclusive distributor of the products of ProPlus Design Solutions in Japan, while providing the electronic design automation environment "SX-Meister series" that automates custom LSI design such as analog/mixed-signal, power device, LCD driver and memory. With the automatic synthesis technology specialized for custom design, SX-Meister has brought significant improvement to the area where the automation approach was difficult to apply in the past. All of the tools are integrated in a constraint-driven database reusing accumulated design know-how that results in significantly improved quality and time to market. Sales and support partners are located in Seoul, Korea; Shanghai, China; Hsinchu, Taiwan; and the U.S. Please visit Jedat on the Web at www.jedat.co.jp

NanoSpice, NanoSpice Giga, NanoYield, BSIMProPlus, NoiseProPlus, MEPro and Nano Design Environment are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions and Jedat acknowledge trademarks or registered trademarks of other organizations for their respective products and services.

For more information, contact:
Nanette Collins
Public Relations
ProPlus Design Solutions
(617) 437-1822
Email Contact

Nobuto Ono
Manager, Product Marketing and Business Development
Jedat, Inc.
+81-3-5847-0312
Email Contact