
Semiconductor Bonding Market Predicted to Hit USD 1.27 billion by 2031, with a 3.6% CAGR
The die-bonding technology segment is projected to grow at a CAGR of 3.75% during the forecast period. WILMINGTON, DE, UNITED STATES, July 23, 2025 /EINPresswire.com/ -- According to a new report published by Allied Market Research, titled, “ …